3D chip technology is pushing the envelope in the memory industry. The latest multilayer non-volatile solutions include 64-layer NAND flash memory from Toshiba, Western Digital, and Micron. Toshiba is sampling its 64-layer, BiCS Flash...
Register or sign in below to download the full article in .PDF format, including high resolution graphics and schematics when applicable.
from Electronic Design http://bit.ly/2cK9Kdv
0 commentaires:
Enregistrer un commentaire