Qualcomm and Himax Technologies Jointly Announce High Resolution 3D Depth Sensing Solution

SAN DIEGOandnbsp;and TAINAN, Taiwan , Aug.andnbsp;Qualcomm Incorporated (NASDAQ: QCOM) and its subsidiary Qualcomm Technologies, Inc., and Himax Technologies, Inc. (NASDAQ: HIMX), today jointly announced a collaboration to accelerate the development and commercialization of a high resolution, low power active 3D depth sensing camera system to enable computer vision capabilities for use cases such as biometric face authentication, 3D reconstruction, and scene perception for mobile, IoT, surveillance, automotive and AR/VR.andnbsp; Click here for more.

from Cellular News http://bit.ly/2x4hLq3