Toshiba Memory Corporation, the world leader in memory solutions, today announced the launch of the BG3 series, a new line-up of single package NVM ExpressTM (NVMe™) client SSDs integrating Toshiba Memory Corporation's cutting-edge 64-layer, 3-bit-per-cell (TLC) BiCS FLASH™ and controller in a ball grid array (BGA) package. Sample shipments to PC OEM customers start today in limited quantities, and Toshiba Memory Corporation will gradually increase shipments from the fourth calendar quarter of this year. Click here for more.
from Cellular News http://bit.ly/2vm3FQD
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