Winbond Introduces TrustME Secure Flash Memory Implementing the Trusted Computing Group (TCG) Device Identifier Composition Engine (DICE) Architecture

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced an expansion of its TrustMETM Secure Flash products portfolio based on the Trusted Computing Group (TCG) Device Identifier Composition Engine (DICE) Architecture specification. Click here for more.

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