Simulate electronics cooling strategies to design products more effectively

Electronic devices are becoming smaller, denser, faster — and harder to keep cool. Heat adversely affects an integrated circuit’s reliability, and interconnecting a system’s chips using 2.5-D interposers or 3-D stacking makes it increasingly difficult to operate within a device’s thermal range.

from Electronic Design - Engineering Essentials Curated By Experts http://bit.ly/2ueDOFS